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SYS-621BT-HNC8R

Key Applications

  • Hyperconverged Infrastructure
  • Scale-Out File Storage
  • Container Storage

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Socket E (LGA 4677) support 4th Gen Intel® Xeon® Scalable processors
  2. Intel® C741
  3. Up to 16 DIMMs ECC DDR5 Slots
  4. 2 PCIe 5.0 x16 (LP) slot;
    Tool-less support
    Internal PCIe 5.0 x8 for 2 M.2 NVMe support onboard
    Optional M.2 NVMe Boot Controller via SCC-A2NM2241G3-B1
  5. Network connectivity via AIOM (OCP 3.0 compliant)
  6. 3 hot-swap 3.5" drive bays (2x PCIe 5.0 NVMe and 1x PCIe 4.0 NVMe/SAS)
    Built-in SAS3 Support via Broadcom 3808; IT Mode
  7. 4 cooling fans per 2U enclosure, 14.9K RPM; Shared Cooling Design
    Liquid Cooling Support
  8. 3000W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Specifications
Product SKUs
SuperServer SYS-621BT-HNC8R (Black front & silver body)
Motherboard
Super X13DET-B
Processor (per Node)
CPU
Cores
  • Up to 32C/64T; Up to 82.5MB Cache
Note
  • Supports up to 300W TDP CPUs (Aircooled)
  • Supports up to 350W TDP CPUs (Liquid Cooled)
  • CPUs (air cooled) with TDP over 185W are only supported under specific conditions. Contact customer support for details.
System Memory (per Node)
Memory
  • Memory Capacity: 16 DIMM slots
  • Up to 4TB: 16x 256 GB DRAM
  • Memory Type: 4800MHz ECC DDR5 RDIMM
On-Board Devices (per Node)
SAS
  • SAS3 (12Gbps) via Broadcom® 3808 (IT mode)
Chipset
  • Intel® C741
Network Connectivity
  • Via AIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node)
LAN
  • 1 RJ45 Dedicated BMC LAN port
USB
  • 2 USB 3.1 port(s) (2 rear)
Video
  • 1 VGA port(s)
Others
  • 2x M.2 for boot drive or caching  
    M.2 form factor: NVMe double-sided 22x110mm
    Note: Enterprise-grade M.2 only for caching application
System BIOS
BIOS Type
  • AMI 32MB Flash ROM
Management
Software
Power Configurations
  • ACPI / APM Power Management
PC Health Monitoring
CPU
  • 8+4 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory.
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-827BQ2-R3K04P
Dimensions and Weight
Height
  • 3.47" (88mm)
Width
  • 17.68" (449mm)
Depth
  • 30.5" (774mm)
Package
  • 9.76" (H) x 24.65" (W) x 45.28" (D)
Weight
  • Net Weight: 66.1 lbs (30 kg)
  • Gross Weight: 96.6 lbs (43.8 kg)
Available Color
  • Black front & silver body
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • HDD activity LED
  • Network activity LEDs
  • Power status LED
  • Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express (PCIe)
  • 2 PCIe 5.0 x16 LP slot(s)
Drive Bays / Storage (per Node)
Hot-swap
  • 3x 3.5" hot-swap NVMe/SAS drive bays
M.2
  • 2 M.2 NVMe
System Cooling
Fans
  • 4x 14.9K RPM Heavy Duty 8cm Fan(s)
Liquid Cooling
  • Direct to Chip (D2C) Cold Plate (optional)
Power Supply
3000W 1U Redundant Power Supply
Total Output Power
  • 3000W : 208 - 240 Vac
  • 3000W : 240 - 240 Vdc for CQC only
Dimension

(W x H x L)
  • 45 x 40 x 480 mm
AC Input
  • 1400W: 100-127Vac / 50-60Hz
  • 2880W: 200-207Vac / 50-60Hz
  • 3000W: 208-240Vac / 50-60Hz
DC Input
  • 3000W: 240-240Vdc for CQC only/ 50-60Hz
12V SB
  • Max: 4.5A / Min: 0A
Certification   Titanium Level

 


  [ Test Report ]
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (Non-Condensing)
  • Non-operating Relative Humidity:
       5% to 95% (Non-Condensing)


Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X13DET-B

CSE-827BQ2-R3K04P
4

1
Super X13DET-B Motherboard

2U Chassis
Backplane BPN-NVME5-827BHQ-S3 1 X13 BigTwin 3.5“ 2U4N Hybrid Backplane
Cable CBL-NSH5-1326 4 NearStack HD (x8 to x8), 26cm,85Ohm,G5,34AWG,RoHS
CBL-PWCD-0200 2 PWCD, Japan, IEC60320, C20 to C21,12AWG,1.8M,RoHS
CBL-SAST-1221-100 4 Slimline x8 (STR) to 2x Slimline x4 (STR),INT,21/16CM,1
Drive Tray(s) MCP-220-00133-0B-BULK 12 Black gen 8 hot-swap 3.5
Air Shroud MCP-310-21734-0B 4 SC217BQ2/827BQ2 BigTwin plastic+mylar air shroud for X13DET-B
Riser Card RSC-PR-6G5 4 1U RHS TwinPro Riser card with one PCIe 5.0 X16 slot,HF
Storage Controller Card SCC-B8SB80-B1 4 1U SCC w/ 8xSAS ports, SAS3808 FatTwin, BigTwin X12, HF,RoHS
SCC-P2HM2G4-B1 4 support 2x Gen4 Hybrid M.2 and 1x PCIEx16 Gen5 Slot
SCC-P6N6SGH-B1 4 1U Hybrid board supports 2x Gen5 NVMe, 4x Gen4 SAS for
Software SFT-OOB-LIC 4 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0087VM 4 1U Passive CPU VC HS w/ Mid Air CH for X13 EGS Platform
SNK-P0087VW 4 1U Passive Customized 100-mm Width CPU VC HS for X13 EGS
*Power Supply PWS-3K04A-1R 2 1U 1400W/2880W/3000W AC/DC PSU with C22 inlet, Titanium, For Bigtwin
*Power Distributor PDB-PT217-BGTNH 1 2U Big Twin PDB input redundancy powers pass through 12V and
*Fan FAN-0191L4 4 80x80x38 mm, 14.9K RPM Cooling Fan in 2U4N 2.5 inches HDD BigTwin Series Servers
*Rail Set MCP-290-00172-0N 1 2U non-tip rail set, quick release, default for 2,3U 17.6";W
*Fan Holder MCP-320-21702-0N 2 Bigtwin fan holder (with 4.1mm rubber feet)(hold 2 80x38 fans)
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
Cold Plate Module SNK-P3050-ABT - 2x Cold Plates for attachment to CPUs
Coolant Distribution Manifolds LCS-SCDM-076V42001-ABT - Coolant manifolds
Coolant Distribution Unit LCS-SCDU-080L4001-ABT - Rack mounted coolant distribution unit
M.2 NVMe RAID Controller SCC-A2NM2241G3-B1 - 2x Gen3 Marvell2241 NVMe M.2 RAID with 1x PCIEx16 Gen5 S
SPI Capable TPM 1.2 AOM-TPM-9671H-S - SPI Capable TPM 1.2 Provisioned for Server, Horizontal Form Factor
SPI Capable TPM 2.0 AOM-TPM-9670H-S - SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor
SPI Capable TPM 2.0 with FIPS 140-2 AOM-TPM-9670H-FIPS - SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor, Supporting FIPS 140-2
SuperCloud Composer License SFT-SDDC-SINGLE - SDDC Monitor License - Single License per Monitored host
System Management Suite SFT-DCMS-Single
DataCenter Management Package (per node license) consists of:
  • OOB Management package capabilities provided by SFT-OOB-LIC
  • Centralized Management Console licenses for health monitoring, power management and firmware upgrades
  • RESTful API support to integrate server management into existing management infrastructure (roadmap Q1’15)
  • Advanced Power Management licenses to manage power on heterogeneous server vendor products
  • Remote Software installation support
  • Remote debug assistance directly from product engineers

Software tools: SSM, SPM, SUM',ABOVE,ol_width=750,ol_border=1,ol_cellpad=6);">SFT-DCMS-Single
- Supermicro System Management Software Suite node