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AS -2014S-TR

Key Applications
- Backup storage
- Web or Database Servers
- Compact Network Appliance

 
Key Features
1. Single AMD EPYC™ 7002/7003 Series Processor
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
2. 8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM
3. 5 PCI-E 4.0 x16 LP slots, 2 PCI-E 4.0 x8 LP slots
4. 2x 1GbE LAN ports, 1 dedicated IPMI LAN port
5. 12 Hot-swap 3.5" SATA3 drive bays,
2 rear Hot-swap 2.5" SATA3 Drive bays
 via optional kit
M.2 Interface: 2 PCI-E 4.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110
M.2 Key: M-Key
Specifications
Product SKUs
AS -2014S-TR
  • A+ Server 2014S-TR (Black)
 
Motherboard

Super H12SSL-i
 
Processor/Chipset
CPU
  • Single AMD EPYC™ 7002/7003 Series Processor
    (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
  • Socket SP3
  • Supports CPU TDP up to 280W
Cores
  • Up to 64 Cores
 
System Memory
Memory Capacity
  • 8 DIMM slots
  • Up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM
Memory Type
  • DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs
 
On-Board Devices
Chipset
  • System on Chip
SATA
  • SATA3 (6Gbps)
Network Controllers
  • Broadcom BCM5720 Gigabit Ethernet Controller
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Video
  • ASPEED AST2500 BMC
 
Input / Output
SATA
  • 8 SATA3 (6 Gbps) ports
LAN
  • 2x 1GbE LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 6 USB 3.0 ports (4 rear, 2 via header)
COM
  • 1 COM Port (rear)
Video
  • 1 VGA port
 
System BIOS
BIOS Type
  • AMI 256Mb SPI Flash EEPROM
 
Management
Software
Power Configurations
  • ACPI / APM Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • 3 Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-LA26TS-R920LPP1
 
Dimensions and Weight
Width
  • 17.2" (437mm)
Height
  • 3.5" (89mm)
Depth
  • 25.5" (648mm)
Package
  • 11.4" (H) x 26.7" (W) x 34.5" (D)
Weight
  • Net Weight: 33.5 lbs (15.2 kg)
  • Gross Weight: 60 lbs (27.2 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
  • Universal Information (UID) LED
 
Expansion Slots
PCI-Express
  • 5 PCI-E 4.0 x16 LP slots
  • 2 PCI-E 4.0 x8 LP slots
 
Drive Bays
Hot-swap
  • 12 Hot-swap 3.5" SATA3 drive bays
  • 2 rear Hot-swap 2.5" SATA3 drive bays via optional kit
 
Backplane
2U SAS/SATA/NVMe HDD Backplane
 
System Cooling
Fans
  • 3x 80x80x38mm middle cooling fans
 
Power Supply
1U 920W redundant power supply
Total Output Power and Input
  • 920W with Input 100 - 127Vac
  • 920W with Input 200 - 240Vac
  • 920W with Input 200 - 240Vdc
Dimension
(W x H x L)
  • 76 x 40 x 336 mm
AC Input Frequency
  • 50-60Hz
+12V
  • Max: 75A / Min: 0A (100Vac-127Vac)
  • Max: 75A / Min: 0A (200Vac-240Vac)
+5Vsb
  • Max: 4A / Min: 0A
Output Type
  • Backplanes (connector)
Certification
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

Parts List
Parts List - (Items Included)
 
Part Number
Qty
Description
Motherboard / Chassis MBD-H12SSL-i
CSE-LA26TS-R920LPP1
1
1
Super H12SSL-i Motherboard
2U Chassis
Backplane BPN-SAS3-LA26A-N12 1 2U 12-Slot LFF Backplane Supports 12 x SAS3/SATA3/NVMe4 Storage Devices with 1x(2x4) + 4x(1x4) power connectors, co-lay with BPN-SAS3-LA26A-N12,HF,RoHS
Cable 1 CBL-PWCD-0160-IS 2 PWCD,US,NEMA5-15P TO IEC60320 C13,6FT,16AWG,RoHS/REACH
Cable 2 CBL-SAST-1234-100 1 Slimline x4 (STR) to 4x SATA,35CM,SB 50CM,Xover,100 OHM,
Cable 3 CBL-SAST-1261-100 1 Slimline x8 (STR) to 2x Slimline x4 (STR),60/60CM,100 O
Parts MCP-260-00042-0N 1 STD I/O shield for X9 socket R server MB with Gasket.
Rail Set MCP-290-00053-0N 1 Rail set, quick/quick, default for 2,3U 17.2";W
Heatsink / Retention SNK-P0063P 1 2U Passive CPU Heat Sink for AMD Socket SP3 Processors
*Power Supply PWS-920P-1R2 2 1U, platinum efficiency,920W,AC input:100-127/200-240Vac,HF,
*Power Distributor PDB-PT826-L8824 1 2U cost effective PDB support up to 1200W.,RoHS
*Cable 3 CBL-0071L 1 ROUND 16 TO 16 PIN RIBBON FP CABLE 30"L, LF
*FAN 1 FAN-0181L4 3 80x80x38 mm, 9.4K RPM, Hot-swappable Middle Cooling Fan
*Drive Tray(s) MCP-220-00184-0B 12 Black gen-9 tool-less cost-effective 3.5
Software SFT-OOB-LIC
OOB Management Package (per node license) consists of:
  • (X10 or Later Only) OOB System Checks such as Asset Information, System Utilization, Sensor Data
  • (X10 or Later Only) BIOS and BMC System Event Log management
  • BIOS Management functions such as in-band/OOB BIOS updates, provision BIOS config and DMI settings
  • BMC Management functions such as OOB BMC F/W updates and provisioning F/W settings
  • (X10 or Later Only) TPM provisioning
  • Scripting capabilities to mount virtual media

Software tools: SUM
',ABOVE,ol_width=750,ol_border=1,ol_cellpad=6);" target="_blank">SFT-OOB-LIC
•
1 OOB Management Package (per node license)
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
  Part Number Qty Description
Rear 2.5" Drive Bay Kit MCP-220-82616-0N - 12G 2.5x2 Drive Kit w/ Status LED(216B/826B/417B/846X/847B)
TPM AOM-TPM-9655V - Vertical TPM with Infineon 9655 TCG 1.2
AOM-TPM-9665V - AOM-TPM-9665V using SLB9665 Chipset supporing TPM2.0,RoHS/REACH
Global Services & Support OS4HR3/2/1 - 3/2/1-year onsite 24x7x4 service
OSNBD3/2/1 - 3/2/1-year onsite NBD service
Software SFT-DCMS-Single
DataCenter Management Package (per node license) consists of:
  • OOB Management package capabilities provided by SFT-OOB-LIC
  • Centralized Management Console licenses for health monitoring, power management and firmware upgrades
  • RESTful API support to integrate server management into existing management infrastructure (roadmap Q1’15)
  • Advanced Power Management licenses to manage power on heterogeneous server vendor products
  • Remote Software installation support
  • Remote debug assistance directly from product engineers

Software tools: SSM, SPM, SUM',ABOVE,ol_width=750,ol_border=1,ol_cellpad=6);">SFT-DCMS-Single
1 DataCenter Management Package (per node license)
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