제품 검색

고객의 미래가 디에스앤지의 미래입니다.

SYS-2029TP-HTR

Key Features
  - Compute Intensive Application
  - HPC, Data Center
  - Enterprise Server
  - Financial Analysis
  - Mission-critical applications

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual Socket P (LGA 3647) support
    2nd Gen Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 (LP) slots
4. Flexible Networking support via SIOM;
    Dedicated IPMI 2.0 LAN
5. 6 Hot-swap 2.5" SAS/SATA drive bays
6. Broadcom 3008 SAS3 controller;
    RAID 0, 1, 1E/10
7. Mini-mSATA (half size) support on 3008
    backplane
8. Up to 2200W Redundant Power Supplies
    Titanium Level (96%)

Specifications
Product SKUs
SYS-2029TP-HC0R
  • SuperServer 2029TP-HC0R (Black)
 
Motherboard (Four per System)

Super X11DPT-PS
 
Processor (per Node)
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-165W*
Cores
  • Up to 28 Cores
Note * Please contact Supermicro Technical Support for supporting conditions of high power (TDP 150W and above) or high base frequency (3.0 GHz and above) processors.
Note *Processors ending N or S are optimized for networking and storage applications. Customer need POC their application and observe any thermal throttling before large deployment.
Note ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
 
System Memory (per Node)
Memory Capacity
  • 16 DIMM slots
  • Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM††
Memory Type
  • 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
†† Cascade Lake only. Contact your Supermicro sales rep for more info.
 
On-Board Devices (per Node)
Chipset
  • Intel® C621 chipset
SAS
  • Broadcom 3008 SAS3 (12Gbps) controller;
       RAID 0, 1, 1E/10 support
Network Controllers
  • Barebones and Complete System must have at least one SIOM or network card installed per node
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output (per Node)
SAS
  • 6 SAS3 (12Gbps) ports
LAN
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
VGA
  • 1 VGA port
Serial Port / Header
  • 1 Fast UART 16550 port / 1 Header (internal)
Others
  • 2 SuperDOM support on the motherboard
  • 1 NVMe or 2 SATA M.2 (22x80/60/42 mm) support with option part: AOC-SMG3-2H8M2
  • M.2 and SuperDOM are for OS boot and they cannot coexist
 
System BIOS
BIOS Type
  • AMI 32MB SPI Flash ROM
 
Management
Software
Power Configurations
  • ACPI Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 5+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Omni-Path Fabric CPUs
  • Do not support
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-217HQ+-R2K20BP3
 
Dimensions and Weight
Width
  • 17.25" (438mm)
Height
  • 3.47" (88mm)
Depth
  • 28.5" (724mm)
Weight
  • Gross Weight: 90 lbs (40.9kg)
  • Net Weight: 72 lbs (32.7 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
  • Universal Information (UID) LED
 
Expansion Slots (per Node)
PCI-Express
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support

    Note: Barebones and Complete System must bundle with Network Card


  • (With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function)
 
Drive Bays (per Node)
Hot-swap
  • 6 Hot-swap 2.5" SAS/SATA HDD trays
 
System Cooling
Fans
  • 4 Heavy duty 8cm PWM fans with optimal fan speed control
 
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power and Input
  • 1200W with Input 100-127Vac
  • 1800W with Input 200-220Vac
  • 1980W with Input 220-230Vac
  • 2090W with Input 230-240Vac
  • 2200W with Input 220-240Vac (for UL/cUL use only)
  • 2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency
  • 50-60Hz
Dimension
(W x H x L)
  • 76 x 40 x 336 mm
+12V
  • Max: 100A / Min: 0A (100-127Vac)
  • Max: 150A / Min: 0A (200-220Vac)
  • Max: 165A / Min: 0A (220-230Vac)
  • Max: 174.17A / Min: 0A (230-240Vac)
  • Max: 183.3A / Min: 0A (220-240Vac)
5VSB
  • Max: 1A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification   Titanium Level
  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

Parts List
Parts List - (Items Included)
 
Part Number
Qty
Description
Motherboard / Chassis MBD-X11DPT-PS
CSE-217HQ+-R2K20BP3
4
1
Super X11DPT-PS Motherboards
2U Chassis
Backplane BPN-ADP-S3008L-L6IP 4 LSI 3008, SAS 12Gbs (X6 port inside)
Backplane BPN-SAS3-217HQ2 1 2U 24-Port 4-Node Backplane Supports 6x2.5
Cable 1 CBL-PWCD-0578 2 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
Air Shroud MCP-310-21716-0B 4 Twinpro X11 air shroud
Riser Card RSC-P-6 4 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
Riser Card RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot
Heatsink / Retention SNK-P0067PS 4 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0067PSM 4 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Power Supply PWS-2K20A-1R 2 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm
Optional Parts List
  Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included) AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
Add-on-Card AOC-SMG3-2H8M2 - AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA),
FST-SCRW-0121L is included in AOC-SMG3-2H8M2
Global Services & Support OS4HR3/2/1
OSNBD3/2/1
-
-
3/2/1-year onsite 24x7x4 service
3/2/1-year onsite NBD service
Software SFT-OOB-LIC
OOB Management Package (per node license) consists of:
  • (X10 or Later Only) OOB System Checks such as Asset Information, System Utilization, Sensor Data
  • (X10 or Later Only) BIOS and BMC System Event Log management
  • BIOS Management functions such as in-band/OOB BIOS updates, provision BIOS config and DMI settings
  • BMC Management functions such as OOB BMC F/W updates and provisioning F/W settings
  • (X10 or Later Only) TPM provisioning
  • Scripting capabilities to mount virtual media

Software tools: SUM
',ABOVE,ol_width=750,ol_border=1,ol_cellpad=6);" target="_blank">SFT-OOB-LIC
•
1 OOB Management Package (per node license)
Software SFT-DCMS-Single
DataCenter Management Package (per node license) consists of:
  • OOB Management package capabilities provided by SFT-OOB-LIC
  • Centralized Management Console licenses for health monitoring, power management and firmware upgrades
  • RESTful API support to integrate server management into existing management infrastructure (roadmap Q1’15)
  • Advanced Power Management licenses to manage power on heterogeneous server vendor products
  • Remote Software installation support
  • Remote debug assistance directly from product engineers

Software tools: SSM, SPM, SUM',ABOVE,ol_width=750,ol_border=1,ol_cellpad=6);">SFT-DCMS-Single
1 DataCenter Management Package (per node license)
Hide Parts List